Industry Application

Semiconductor
& Electronics Manufacturing

Ultra-clean sintered metal filter elements for process gas delivery, chemical mechanical polishing slurry, and cleanroom environment control — where a single metal particle above the critical dimension kills a chip yield target.

Ultra-pure Gas Cleanroom N₂ / Ar / H₂ Low Particle Risk Consistent Pore Rating
0.5 µmSub-micron capable
316L EPElectropolished SS
LowMedia migration risk
CleanpackControlled packaging options
Industry Overview

Particle-Free Filtration for Sub-Nanometre Process Nodes

As semiconductor feature sizes shrink, the tolerance for particulate contamination also narrows. In process gas and DI water service, filter elements are selected for stable pore structure, clean surfaces, and low risk of media migration during operation.

Sintered stainless steel filter elements with electropolished internal surfaces address the particle cleanliness requirement. The sintered metal matrix is mechanically stable — no fibers, no binders, no migration risk. The electropolished surface reduces surface area available for particle adhesion and outgassing.

FILTURE supplies SS 316L electropolished sintered filter elements for semiconductor process gas delivery, chemical distribution, and CMP slurry filtration. For DI water polishing loops and gas diffusion applications, our sintered porous discs and tubes provide controlled distribution. Clean packaging and particle count testing are available on request for critical applications.

Housing dimensions are held to tight tolerances through post-sinter precision machining, and every batch can ship with particle count and material test reports for fab qualification records.

0.5 µmMinimum pore size available
EPElectropolished Ra ≤ 0.4 µm standard
Solid MatrixLow fiber or media migration risk
N₂/Ar/H₂Inert gas compatible alloy standards
Applications

Filtration Points Across the Semiconductor Process

Process Gas Delivery Filtration

Sintered SS inline filters on N₂, Ar, H₂, and specialty gas distribution lines — a tightly-controlled pore size barrier limiting particles reaching process chambers, deposition tools, and etch systems.

0.5–5 µm · Electropolished · Low migration risk

CMP Slurry Point-of-Use Filter

Point-of-use filtration on chemical mechanical polishing slurry distribution — removing oversized abrasive particles before they reach the polishing pad and cause micro-scratch defects on wafer surfaces.

0.5–2 µm · Abrasion-resistant SS

Wet Chemical Distribution

Sintered SS filters on H₂O₂, HF, and other wet process chemical delivery systems — fine particle removal upstream of wafer wet-cleaning tools and etching baths.

1–5 µm · Chemical-resistant SS or Ti

Cleanroom HVAC Pre-filtration

Metal pre-filters on cleanroom HVAC and make-up air systems — protecting HEPA and ULPA filter banks from coarse particulate loading, extending final-filter service intervals.

5–50 µm · Stainless steel · Long life

DI Water Final Filtration

Sintered SS elements as point-of-use filters on deionised water distribution loops — removing particles and bio-burden before water contacts wafer surfaces in cleaning and rinsing operations.

0.22–1 µm · DI-compatible · EP finish

Diffusion Furnace Atmosphere Control

Gas inlet sintered filters on diffusion and oxidation furnaces — maintaining ultra-pure N₂ and O₂ atmosphere in tube furnaces where any metallic contamination causes device leakage.

0.5–2 µm · High-purity · No outgassing
Recommended Products

Ultra-Clean Filters for Semiconductor Environments

Electropolished surface finish, controlled packaging options, and particle count test reports are available on request for critical semiconductor applications.

Why FILTURE

What Semiconductor Process Engineers Demand

Low Media Migration Risk

Sintered SS is a solid, rigid structure with no loose fiber layers or binder resin in the filtration body. Compared with woven or polymer-based media, the sintered matrix is often selected where low particle release risk is important.

Electropolished to Semiconductor Standard

We offer electropolishing of all SS sintered elements to Ra ≤ 0.4 µm — the surface cleanliness standard required for semiconductor-grade process equipment. This minimises surface area for particle adhesion and eliminates micro-roughness that can trap contamination.

Pore Rating with Test Documentation

Bubble distribution analysis is available on request, documenting pore-size distribution across the filter surface. Dimensional records and material certifications provided — semiconductor process engineers who need individual traceability can request the full documentation package.

Other Industries

Beyond Semiconductor: Other Industries We Serve

Client Feedback

What Semiconductor Customers Say

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After installing FILTURE Ti porous discs in our DI water polishing loop, downstream cleanliness became more stable and easier to manage during the first several hundred hours of operation.

Fab Process Engineer Semiconductor Manufacturer · Taiwan
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We needed contamination-free filtration for a lithography process. The electropolished Ti surface was verified with XRF — no detectable iron leaching. Cleanroom-compliant packaging made incoming inspection straightforward.

Cleanroom Engineer Fab Equipment Company · Japan

Specify Ultra-Clean Filters for Your Semiconductor Process

Share your gas type, operating pressure, pore size target, and surface cleanliness requirements. We'll confirm electropolish capability, packaging options, and particle count testing availability.

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